Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1991-06-17
1993-06-29
Hille, Rolf
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257714, 257722, 165 803, 165 804, 361385, H01L 3902, H01L 2504
Patent
active
052237478
ABSTRACT:
Heat dissipating devices for electronic component semiconductor chips are provided in the form of channels or grooves which are either integrated in the underside of the semiconductor chip or are formed in an additional thin semiconductor chip which has larger dimensions than the component chip and which is disposed between the underside of the component chip and the mounting base for the component chip. The channels are filled with a meltable material which is subjected to a heat absorbing phase conversion at temperatures which are critical for semiconductor component operation. In this way, short-term heat peaks in particular, can be reliably dissipated. Preferably, the channels are formed by micromechanical etching techniques and are preferably filled to the desired degree by a spin coating process.
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A. Heuberger, Micromechanik, 1989, pp. 128-140, and pp. 478-483, (Springer Verlag).
J. M. Eldridge and K. E. Petersen, IBM Technical Disclosure Bulletin, vol. 25 No. 8, Jan. 1983, pp. 4118-4119.
Battelle-Institut e.V.
Hille Rolf
Ostrowski David
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