Heat dissipating device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257714, 257722, 165 803, 165 804, 361385, H01L 3902, H01L 2504

Patent

active

052237478

ABSTRACT:
Heat dissipating devices for electronic component semiconductor chips are provided in the form of channels or grooves which are either integrated in the underside of the semiconductor chip or are formed in an additional thin semiconductor chip which has larger dimensions than the component chip and which is disposed between the underside of the component chip and the mounting base for the component chip. The channels are filled with a meltable material which is subjected to a heat absorbing phase conversion at temperatures which are critical for semiconductor component operation. In this way, short-term heat peaks in particular, can be reliably dissipated. Preferably, the channels are formed by micromechanical etching techniques and are preferably filled to the desired degree by a spin coating process.

REFERENCES:
patent: 3215194 (1965-11-01), Sununu et al.
patent: 3780356 (1973-12-01), Laing
patent: 4323914 (1982-04-01), Berndlmaier et al.
patent: 4833567 (1989-05-01), Saaski et al.
patent: 4962416 (1990-10-01), Jones et al.
patent: 5012858 (1991-05-01), Natori et al.
patent: 5014777 (1991-05-01), Sano
C. M. Osburn et al., "Structure and Process for a Silicon Wafer Chip Carrier", Research Disclosure, Apr. 1988.
A. Heuberger, Micromechanik, 1989, pp. 128-140, and pp. 478-483, (Springer Verlag).
J. M. Eldridge and K. E. Petersen, IBM Technical Disclosure Bulletin, vol. 25 No. 8, Jan. 1983, pp. 4118-4119.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Heat dissipating device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat dissipating device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipating device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1757842

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.