Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2007-01-23
2007-01-23
Quach, T. N. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S536000, C257SE23080
Reexamination Certificate
active
10907873
ABSTRACT:
A structure and method are disclosed for heat dissipation relative to a heat generating element in a semiconductor device. The structure includes a plurality of heat transmitting lines partially vertically coincidental with the heat generating element, and at least one interconnecting path from each heat transmitting line to a substrate of the semiconductor device. In one embodiment, the heat generating element includes a resistor in a non-first metal level. The invention is compatible with conventional BEOL interconnect schemes, minimizes the amount of heat transfer from the resistor to the surrounding interconnect wiring, thus eliminating the loss of current carrying capability in the wiring.
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Chinthakindi Anil K.
Clevenger Lawrence A.
Lee Tom C.
Matusiewicz Gerald
Murray Conal E.
Hoffman Warnick & D'Alessandro LLC
International Business Machines - Corporation
Petrokaitis Joseph
Quach T. N.
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