Heat dissipation assembly and method for producing the same

Details Heat dissipation assembly and method for producing the same Heat dissipation assembly and method for producing the same

2007-03-27

2007-03-27

Clark, S. V. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S706000

Reexamination Certificate

active

11069293

ABSTRACT:
A heat dissipation assembly in which a heat generator and a heat dissipator are integrated via an electrically insulating and thermally conductive sheet, at least one surface of which a thermally conductive grease is applied to, in which the thermally conductive grease is incompatible with the electrically insulating and thermally conductive sheet. Heat from the heat generator such as a semiconductor device or the like can be effectively dissipated while an electrically insulating condition is maintained over a long period of time.

REFERENCES:
patent: 4962416 (1990-10-01), Jones et al.
patent: 5170930 (1992-12-01), Dolbear et al.
patent: 6706562 (2004-03-01), Mahajan et al.
patent: 6787899 (2004-09-01), Rinella et al.
patent: 11-135691 (1999-05-01), None

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