C4 package die backside coating

Details C4 package die backside coating C4 package die backside coating

1997-12-10

1999-08-10

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257737, 257778, H01L 2314

Patent

active

059363045

ABSTRACT:
According to one aspect of the invention there is provided a semiconductor chip comprising a semiconductor die, an array of electrical contacts on an integrated circuit in a frontside of the die, and a protective layer on a backside of the die.

REFERENCES:
patent: 5311059 (1994-05-01), Banerji et al.
patent: 5319242 (1994-06-01), Carney et al.

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