LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package,With contact or lead

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

System-on-a-chip with multi-layered metallized through-hole...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

System-on-a-chip with multi-layered metallized through-hole...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

System-on-a-chip with multi-layered metallized through-hole...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Systems having advanced pre-formed planar structures

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Systems interconnected by bumps of joining material

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Tab tape and semiconductor device using the tab tape

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Tab tape, method of making same and semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Tap connections for circuits with leakage suppression...

Reissue Patent

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Tap connections for circuits with leakage suppression...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Tape application platform and processes therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Tape automated bonding package for a semiconductor chip employin

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Tape carrier for BGA and semiconductor device using the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Tape carrier package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Tape circuit substrate having wavy beam leads and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Tape wiring substrate and chip-on-film package using the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Tape wiring substrate and chip-on-film package using the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Technique for attaching die to leads

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Techniques for optimizing electrical performance and layout...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Techniques for optimizing electrical performance and layout...