Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2007-11-13
2007-11-13
Chambliss, Alonzo (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S700000, C257S758000, C257S774000, C174S255000, C174S262000, C174S265000, C361S748000, C361S764000, C361S767000, C361S777000
Reexamination Certificate
active
11248144
ABSTRACT:
The present invention is directed to a high-performance system on a chip which uses multi-layer wiring/insulation through-hole interconnections to provide short wiring and controlled low-impedance wiring including ground planes and power supply distribution planes between chips.
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Ahn Kie Y.
Forbes Leonard
Chambliss Alonzo
Dickstein & Shapiro LLP
Micro)n Technology, Inc.
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