Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1995-12-29
1998-06-23
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257774, 257778, 257786, H01L 2304
Patent
active
057708894
ABSTRACT:
An electronic system utilizing at least one semiconductor die having raised conductive bumps on its surface for connecting to other devices or systems is disposed on a face of a preformed planar structure (interposer) having through holes. Solder joints with conductive bumps on an underlying substrate are formed in the through holes. In one embodiment, the interposer is dissolvable. In another embodiment, the through holes are at least partially filled with a conductive material for electrically connecting to the die. In another embodiment, the through holes are angled so that the interposer acts as a pitch spreader or adapter. In another embodiment, ball bumps are disposed on a side of the interposer away from the die. In the electronic system, a semiconductor die may be disposed on a side of an optically transmissive preformed planar structure (interposer), and an optical element is disposed on an opposite side of the interposer. The interposer may be provided with through holes extending at least partially into the die side, and electrical probes in the through holes, for making contact to raised conductive bumps on the die. The interposer may be provided with raised portions for locating the optical element at a predetermined distance away from the die. The interposer may be provided with darkened areas for preventing light from impacting selected areas of the die. Various other embodiments are directed to multi-tier flip-chip arrays employing preformed planar structures between tiers.
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Pasch Nicholas F.
Rostoker Michael D.
LSI Logic Corporation
Potter Roy
Thomas Tom
LandOfFree
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