Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1997-06-19
1999-04-06
Brown, Peter Toby
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257752, H01L 2348
Patent
active
058922776
ABSTRACT:
In a TAB tape, dummy copper foil patterns are provided on the portions of an adhesive on which neither pads nor leads are provided, thereby flattening the upper surface of solder resist coated on the resultant structure.
REFERENCES:
patent: 4916514 (1990-04-01), Nowak
Fukuoka Yutaka
Ikemizu Morihiko
Okutomo Takayuki
Takeuchi Masafumi
Brown Peter Toby
Kabushiki Kaisha Toshiba
Potter Roy
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