Tab tape, method of making same and semiconductor device

Details Tab tape, method of making same and semiconductor device Tab tape, method of making same and semiconductor device

2005-02-08

2005-02-08

Clark, S. V. (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S783000

Reexamination Certificate

active

06853065

ABSTRACT:
A TAB tape has: a tape substrate of insulating material; a first wiring pattern of conductive material, the first wiring pattern being formed on one surface of the tape substrate; a second wiring pattern of conductive material, the second wiring pattern being formed on the other surface of the tape substrate; a conduction part that allows electrical conduction between the first wiring pattern and the second wiring pattern; and a stiffener that is adhered through adhesive to the other surface of the tape substrate. In the TAB tape, the second wiring pattern includes an insulating material filled in a groove region where no wiring pattern is formed around wiring patterns of the second wiring pattern.

REFERENCES:
patent: 5409865 (1995-04-01), Karnezos
patent: 5420460 (1995-05-01), Massingill
patent: 5844168 (1998-12-01), Schueller et al.
patent: 6259154 (2001-07-01), Niwa
patent: 6436733 (2002-08-01), Yukawa
patent: 6509643 (2003-01-01), Ohtaka et al.
patent: 6621160 (2003-09-01), Shibamoto et al.
patent: 6696764 (2004-02-01), Honda
patent: 6734535 (2004-05-01), Hashimoto
patent: 2001-110936 (2001-04-01), None
patent: 2002-16175 (2002-01-01), None
patent: 2000-311720 (2002-04-01), None
patent: 2002-118217 (2002-04-01), None
patent: 2002-124549 (2002-04-01), None

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