Tape circuit substrate having wavy beam leads and...

Details Tape circuit substrate having wavy beam leads and... Tape circuit substrate having wavy beam leads and...

2007-07-24

2007-07-24

Owens, Douglas W. (Department: 2821)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S696000, C257S735000

Reexamination Certificate

active

10739456

ABSTRACT:
A semiconductor chip package includes an IC chip and a tape circuit substrate. The tape circuit substrate has a base film and a plurality of beam leads formed on the base film. One end portion of each beam lead extends from the base film, and the extended portion has a widthwise wavy portion. The widthwise wavy portion may be, for example, semicircular shaped, S-shaped or zig-zag shaped. The IC chip has chip pads formed on a top surface thereof.

REFERENCES:
patent: 5744859 (1998-04-01), Ouchida
patent: 6037662 (2000-03-01), Yoon et al.
patent: 6278176 (2001-08-01), Nakamura et al.
patent: 08-316270 (1996-11-01), None
patent: 10-261673 (1998-09-01), None
patent: 2001255550 (2001-09-01), None
patent: 1997-58422 (1997-07-01), None
patent: 1999-69806 (1999-09-01), None
English language abstract of Japanese Publication No. 08-316270, Nov. 29, 1996.
English language abstract of Korean Publication No. 10-282003, Nov. 23, 2000.
English abstract of Korean Publication No. 1999-69806, Sep. 6, 1999.
English abstract of Korean Publication No. 1997-58422, Jul. 31, 1997.
English abstract of Japanese Publication No. JP2001255550, Sep. 21, 2001.
English abstract of Japanese Publication No. 10-261673, Sep. 29, 1998.

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