LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package,With contact or lead

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead frame design for increased chip pinout

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead frame for a semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead frame for semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead frame for use with an RF powered semiconductor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead frame having chip mounting part and leads of different...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead frame having supporters and semiconductor package using sam

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead frame including suspending leads having trenches formed...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead frames including inner-digitized bond fingers on bus...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead on chip lead frame design without jumpover wiring

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead on chip type semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead pin, circuit, semiconductor device, and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead-frame having unused input/output terminals separated from i

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead-frame-based semiconductor package and fabrication...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead-free integrated circuit package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Leaded semiconductor device having accessible power supply pad t

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Leaded substrate carrier for integrated circuit device and leade

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Leadframe and method of manufacturing a semiconductor device...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Leadframe for making semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Leadframe, semiconductor package and support lead for...