Leadframe for making semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Patent

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Details

257695, 257773, H01L 2348, H01L 2944, H01L 2952

Patent

active

054669685

ABSTRACT:
A leadframe is provided for making semiconductor devices. The leadframe comprises at least one island arranged centrally widthwise of the leadframe and having four corner portions, four bridging legs radially extending from the respective corner portions of the island, the bridging legs being integral with the leadframe and island; and a multiplicity of leads radially extending toward but spaced from the island, the leads being integral with the leadframe. The leads have respective tips which are progessively closer to the island toward the respective bridging legs.

REFERENCES:
patent: 5245214 (1993-09-01), Simpson

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