Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2011-01-25
2011-01-25
Arroyo, Teresa M (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S670000, C257S676000, C257S696000
Reexamination Certificate
active
07875968
ABSTRACT:
Leadframe for a semiconductor package and manufacturing from such leadframe including a plurality of connection leads supported in a frame. Die mounting plate is centrally located in the leadframe and is supported by a plurality of support leads which are electrically connected to the die mounting pad and extending in a direction outwardly therefrom towards the frame. Each support lead is formed with a connection pad portion and a down set link portion. Each connection pad portion is spaced from the die mounting plate and is connected to a conductive bonding ground wire from a semiconductor device mounted on the die mounting plate. Each down set link portion is electrically connected to the die mounting pad and supports the die mounting pad in a spaced arrangement from the connection leads. The connection pad portion and the down set link portion overlap, in the direction of extension of the support lead.
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Li Wu Hu
Low Min Wee
Wagiman Mohamad Yazid
Arroyo Teresa M
Infineon - Technologies AG
Slater & Matsil L.L.P.
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