LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package,With contact or lead

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Inverted chip bonded with high packaging efficiency

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Inverter module having a plurality of terminals at a...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Isolated stripline structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Jogging structure for wiring translation between grids with...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Jumper chip component and mounting structure therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Jumper chip component and mounting structure therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Laminate substrate and semiconductor package utilizing the...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Laminated multilayer substrates

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Land pattern configuration

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Larger than die size wafer-level redistribution packaging...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Layered features for co-fired module integration

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Layout method for thin and fine ball grid array package...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Layout of Vdd and Vss balls in a four layer PBGA

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Layout structure and method for supporting two different...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead formation using grids

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead frame and flip chip semiconductor package with the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead frame decoupling capacitor semiconductor device...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Lead frame decoupling capacitor, semiconductor device...