Jumper chip component and mounting structure therefor

Details Jumper chip component and mounting structure therefor Jumper chip component and mounting structure therefor

2006-08-29

2006-08-29

Pham, Hoai (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S730000, C361S777000

Reexamination Certificate

active

07098531

ABSTRACT:
A jumper chip component of the present invention includes a connection conductor formed of a conductive layer over an upper face and opposite side faces of an insulating substrate, and a conductive material formed of a conductive layer between plates of the insulating substrate and on a side face at the corner of the insulating substrate so as not to be electrically connected to the connection conductor. Since the conductive material formed between the plates of the insulating substrate opposes the connection conductor formed on the upper face of the insulating substrate, the connection conductor formed on the upper face of the insulating substrate and a second conductive pattern disposed under the insulating substrate are shielded from each other by the conductive material, and good isolation is possible.

REFERENCES:
patent: 4288840 (1981-09-01), Konishikawa et al.
patent: 5532658 (1996-07-01), Tonegawa et al.
patent: 5907265 (1999-05-01), Sakuragawa et al.
patent: 6751101 (2004-06-01), Sakai
patent: 1 047 291 (2000-04-01), None
patent: 03071572 (1991-03-01), None
patent: 03110768 (1991-05-01), None
patent: H05-050672 (1993-07-01), None
patent: 07335995 (1995-12-01), None
Search Report dated Sep. 16, 2004 for European Patent Application No. 02 25 8422.

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