Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1998-07-14
1999-11-16
Williams, Alexander Oscar
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257758, 257686, 257774, 257723, 257730, H01L 23053, H01L 2348
Patent
active
059863390
ABSTRACT:
A multilayer package includes a plurality of interconnected large-layer-count (LLC) substrates. The LLC substrates each include conductive pads on the top and bottom surfaces of the substrate, a via in the substrate including conductive material to contact the pads on the top and bottom surfaces, and a post on a pad over the via. The posts of the substrates confront and abut each other, and are electrically bonded together. A non-flowable adhesive film mechanically bonds the LLC substrates, and has an aperture receiving the posts of the substrates.
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Chevalier Jeanne M.
Denny Ronald R.
Krinke Terrance A.
Lufkin Robert M.
Pai Deepak K.
General Dynamics Information Systems, Inc.
Williams Alexander Oscar
LandOfFree
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