LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package,With contact or lead

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multi-functional memory chip connector

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multi-layer C4 flip-chip substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multi-layer circuit substrates and electrical assemblies having

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multi-layer electrical interconnection structures

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multi-layer lead frame for a semiconductor device with contact g

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multi-layer semiconductor package substrate with thermally-condu

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multi-layered pin grid array interposer apparatus and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multi-layered printed circuit board, and grid array package adop

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multi-layered, integrated circuit package having reduced parasit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multi-layered, integrated circuit package having reduced parasit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multi-path bar bond connector for an integrated circuit...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multi-power ring chip scale package for system level...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multi-power ring chip scale package for system level...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multi-step transmission line for multilayer packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multi-surface IC packaging structures and methods for their...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multi-surface IC packaging structures and methods for their...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multichip circuit module and method for the production thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multichip circuit module and method for the production thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multichip integrated circuit modules