Multi-layered printed circuit board, and grid array package adop

Details Multi-layered printed circuit board, and grid array package adop Multi-layered printed circuit board, and grid array package adop

1996-09-25

1998-12-08

Arroyo, Teresa Maria

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257531, 257701, 257723, 257924, 361777, 361782, 361794, H01L 2348, H01L 2900, H01L 29053, H01L 2334

Patent

active

058474510

ABSTRACT:
In a multi-layered printed circuit board on which an LSI having a plurality of power supply pins and a plurality of signal pins is mounted, and a grid array package which adopts the printed circuit board, some or all of the plurality of power supply pins are connected to a power supply pattern via an inductance pattern, thereby reducing generation of radiation noise.

REFERENCES:
patent: 4035695 (1977-07-01), Knutson et al.
patent: 5027089 (1991-06-01), Henke
patent: 5068631 (1991-11-01), Vince
patent: 5131140 (1992-07-01), Zimmer
patent: 5278524 (1994-01-01), Mullen
patent: 5488539 (1996-01-01), Testa et al.
patent: 5504370 (1996-04-01), Lin et al.
patent: 5650665 (1997-07-01), Yamamoto et al.
patent: 5661336 (1997-08-01), Phelps, Jr. et al.

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