Multi-directional wiring on a single metal layer

Details Multi-directional wiring on a single metal layer Multi-directional wiring on a single metal layer

2005-02-22

2005-02-22

Eckert, George (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S758000, C257S773000, C257S776000, C257S786000, C716S030000, C716S030000, C716S030000, C716S030000, C716S030000, C716S030000

Reexamination Certificate

active

06858928

ABSTRACT:
An integrated circuit has a metal layer that includes conductors to provide interconnectivity for components of the integrated circuit chip. The metal layer is divided into at least two sections, such that a first section has a preferred direction and the second section has a preferred wiring direction that is different from the first preferred direction. The first and second preferred directions on a single metal layer may consist of any direction. The metal layer may be divided into more than two sections, wherein each section has a preferred wiring direction. Wiring geometries for multi-level metal layers are also disclosed.

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