Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2006-02-13
2010-06-15
Purvis, Sue (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257SE23010, C257SE23061
Reexamination Certificate
active
07737545
ABSTRACT:
An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.
REFERENCES:
patent: 4691972 (1987-09-01), Gordon
patent: 5373109 (1994-12-01), Argyrakis et al.
patent: 5475264 (1995-12-01), Sudo et al.
patent: 5530287 (1996-06-01), Currie et al.
patent: 5543586 (1996-08-01), Crane, Jr. et al.
patent: 5623160 (1997-04-01), Liberkowski
patent: 5821457 (1998-10-01), Mosley et al.
patent: 5906948 (1999-05-01), Liu et al.
patent: 5969421 (1999-10-01), Smooha
patent: 6001671 (1999-12-01), Fjelstad
patent: 6020559 (2000-02-01), Maeda
patent: 6054652 (2000-04-01), Moriizumi et al.
patent: 6055722 (2000-05-01), Tighe et al.
patent: 6284984 (2001-09-01), Ohyama
patent: 6369454 (2002-04-01), Chung
patent: 6421254 (2002-07-01), Crane, Jr. et al.
patent: 6440770 (2002-08-01), Banerjee et al.
patent: 6441498 (2002-08-01), Song
patent: 6538310 (2003-03-01), Hoshino et al.
patent: 6635957 (2003-10-01), Kwan et al.
patent: 6680530 (2004-01-01), Pillai et al.
patent: 6818973 (2004-11-01), Foster
patent: 6900390 (2005-05-01), Halter
patent: 6900528 (2005-05-01), Mess et al.
patent: 7047637 (2006-05-01), deRochemont et al.
patent: 2001/0050426 (2001-12-01), Hoshino et al.
patent: 2002/0070446 (2002-06-01), Horuchi et al.
patent: 2003/0153122 (2003-08-01), Brooks
patent: 2005/0184376 (2005-08-01), Salmon
patent: 09-246684 (1997-09-01), None
Fjelstad Joseph C.
Grundy Kevin P.
Obenhuber Thomas J.
Obenhuber, legal representative Inessa
Segaram Para K.
Interconnect Portfolio LLC
Purvis Sue
Shea, Esq. Ronald R.
Soderholm Krista
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