Multi-layer semiconductor package substrate with thermally-condu

Details Multi-layer semiconductor package substrate with thermally-condu Multi-layer semiconductor package substrate with thermally-condu

1994-04-11

1996-03-19

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257702, 257789, H01L 23053, H01L 2312, H01L 2314

Patent

active

055005551

ABSTRACT:
Improved thermal characteristics are obtained in a multi-layer substrate for mounting a semiconductor device. A prepeg layer disposed in close proximity to or immediately adjacent to a semiconductor device is formed incorporating an integral, thermally-conductive mesh or screen. The prepeg layer is preferably a sandwich structure of two BT-resin layers (films), between which is disposed a copper screen. In this manner, heat is conducted away from an operating device by an integral part of the substrate, without the need for additional slugs or heat sink structures. Utility for multichip modules is also disclosed.

REFERENCES:
patent: 4972253 (1990-11-01), Palino et al.
patent: 5043794 (1991-08-01), Tai et al.
patent: 5179777 (1993-01-01), Suzuki
patent: 5196725 (1993-03-01), Mita et al.
patent: 5291062 (1994-03-01), Higgins, III

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