Die to die connection method and assemblies and packages...
Direct contact through hole type wafer structure
Direct contact through hole type wafer structure
Direct stacked and flip chip power semiconductor device structur
Directly bonded SIMM module
Double sided semiconduction device with edge contact and...
Double-packaged multi-chip semiconductor module
Double-sided circuit board and multi-chip package including...
Double-sided cooling isolated packaged power semiconductor...
Dual chip in package with a wire bonded die mounted to a...
Dual die memory
Dual die memory
Dual-die package structure and method for fabricating the same
Electrical device and method
Electrical interface to integrated circuit device having...
Electrical shielding in stacked dies by using conductive die...
Electronic circuit and method with thermal management
Electronic circuit module with a carrier having a mounting...
Electronic component and process for producing the...
Electronic component having at least one vertical...