Double-sided circuit board and multi-chip package including...

Details Double-sided circuit board and multi-chip package including... Double-sided circuit board and multi-chip package including...

2007-01-30

2007-01-30

Parker, Kenneth (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S685000, C257S676000, C257S666000, C257S787000, C425S116000, C249S090000, C249S093000, C264S272170

Reexamination Certificate

active

10186101

ABSTRACT:
A multi-chip package comprises a double-sided circuit board having first and second surfaces. Each surface has a package area and a peripheral area. Each package area has a chip mounting area on which a chip is attached, and a bonding area with which the chip is electrically connected. The peripheral area of the first surface has a runner area on which molding compound flows, and the peripheral area of the second surface has external connection pattern with which the bonding areas are electrically connected. In particular, the circuit board has gate holes, which are co-located on each surface to result in a common hole.

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German Office Action dated Nov. 15, 2006.

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