Double-packaged multi-chip semiconductor module

Details Double-packaged multi-chip semiconductor module Double-packaged multi-chip semiconductor module

2007-08-21

2007-08-21

Graybill, David E. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S725000, C257S686000, C257S701000, C257S708000, C257S709000, C257S710000, C257S723000, C257S724000, C257S704000, C257SE25029, C257SE25029

Reexamination Certificate

active

10423122

ABSTRACT:
A plurality of semiconductor die is packaged into one component. The inventive design comprises devices which have been singularized, packaged and thoroughly tested for functionality and adherence to required specifications. A plurality of packaged devices is then received by a housing. The conductive leads of the packaged devices are electrically coupled with pads manufactured into the housing. These pads are connected to traces within the housing, which terminate externally to the housing. Input/output leads are then electrically coupled with the traces, or are coupled with the traces as the housing is manufactured. The input/output leads provide means for connecting the housing with the electronic device or system into which it is installed. A lid received by the housing hermetically seals the packaged die in the housing, and prevents moisture or other contaminants which may impede the proper functionality of the die from entering the housing.

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