Directly bonded SIMM module

Details Directly bonded SIMM module Directly bonded SIMM module

1995-09-26

1999-10-05

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257723, 257203, H01L 2302

Patent

active

RE0363251

ABSTRACT:
A leadframe interconnect package is tape automated bond (TAB) bonded to circuitry on the chip and which provides a circuit connection for subsequent connection to a printed circuit board. The encapsulated chips will replace both the leadframe and printed circuit board (electrical only) as we now know it in the conventional SIMM module.

REFERENCES:
patent: 4656605 (1987-04-01), Clayton
patent: 4903113 (1990-02-01), Frankeny et al.

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