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Package structures

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Packaged microdevices and methods for manufacturing packaged...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Packaged microelectronic devices and methods for assembling...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Packaged microelectronic devices and methods for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Packaged semiconductor device assembly including two interconnec

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Packaged stacked semiconductor die and method of preparing same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Packages for electronic devices implemented with laminated...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Packaging for multi-processor shared-memory system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Packaging for semiconductor logic devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Packaging method of a plurality of chips stacked on each...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Packaging substrate having heat-dissipating structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Pad redistribution chip for compactness, method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Panel stacking of BGA devices to form three-dimensional modules

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Panel stacking of BGA devices to form three-dimensional modules

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Panel structure with plurality of chip compartments for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Partially captured oriented interconnections for BGA...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Partitioned integrated circuit package with central clock...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Phased array antenna using (MEMS) devices on low-temperature...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Physical quantity sensor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Pitch change and chip scale stacking system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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