Physical quantity sensor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

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Details

C257SE25006

Reexamination Certificate

active

07468552

ABSTRACT:
A physical quantity sensor includes a package, a circuit chip disposed and held in the package, a sensor chip stacked and fixed on the circuit chip, and a wiring member having flexibility, through which the circuit chip and the package are electrically and mechanically bonded together. In the physical quantity sensor, unwanted external vibrations transmitted to the sensor chip are reduced without an external vibration dumping system such as a rubber pad, because the wiring member weakens the vibrations.

REFERENCES:
patent: 6005778 (1999-12-01), Spielberger et al.
patent: 6236109 (2001-05-01), Hsuan et al.
patent: 6249046 (2001-06-01), Hashimoto
patent: 6848306 (2005-02-01), Kunda
patent: 6911721 (2005-06-01), Aoyagi
patent: 7023076 (2006-04-01), Khiang
patent: 7081373 (2006-07-01), Roeters et al.
patent: 2004/0182157 (2004-09-01), Sakai et al.
patent: 2005/0104186 (2005-05-01), Yang et al.
patent: A-9-219423 (1997-08-01), None

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