Packaging substrate having heat-dissipating structure
Pad redistribution chip for compactness, method of...
Panel stacking of BGA devices to form three-dimensional modules
Panel stacking of BGA devices to form three-dimensional modules
Panel structure with plurality of chip compartments for...
Partially captured oriented interconnections for BGA...
Partitioned integrated circuit package with central clock...
Phased array antenna using (MEMS) devices on low-temperature...
Physical quantity sensor
Pitch change and chip scale stacking system
Pitch change and chip scale stacking system and method
Planar array contact memory cards
Polyhedral IC package for making three dimensionally expandable
Power converter and method for producing the same
Power distribution in multi-chip modules
Power distribution within a folded flex package method and...
Power electronic device
Power module
Power semiconductor component
Power semiconductor device