Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2005-04-14
2008-12-16
Potter, Roy K (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S723000
Reexamination Certificate
active
07466020
ABSTRACT:
The invention relates to a power module comprising a substrate (2), whose surfaces are provided with at least one electrically conductive layer (4, 6), at least one active semiconductor chip (8), which is electrically connected to an electrically conductive layer (6), a film (12) consisting of an electrically conductive material, which is in close contact with the surfaces of the semiconductor chips (8) of the electrically conductive layer (6) and the substrate (2) and is provided with planar printed conductors (16). According to the invention: the module is equipped with a second film (18), which is in close contact with the surfaces of the printed conductors (16) and the first film (12); a passive semiconductor chip (22) is applied to said second film (18), above the active semiconductor chip (8) and is electrically connected to the planar printed conductor (16) lying below by means of a window (14) that is configured in the second film (18); the module is equipped with a third film (24), which is in close contact with the surfaces of the passive semiconductor chip (22) and the second film (18) and said third film (24) is provided with a planar printed conductor (28), which is conductively connected to the conductive layer (6) lying below the active semiconductor chip (8). The invention thus provides a compact power module that can comprise complex topologies.
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patent: 5532512 (1996-07-01), Fillion et al.
patent: 6630727 (2003-10-01), Tutsch et al.
patent: 6642576 (2003-11-01), Shirasawa et al.
patent: 2003/0006493 (2003-01-01), Lee
patent: 2003/0111721 (2003-06-01), Nakanishi et al.
patent: 2006/0197220 (2006-09-01), Beer
patent: 1 170 794 (2002-01-01), None
patent: 1 317 001 (2003-06-01), None
patent: WO 03/030247 (2003-04-01), None
Eckardt Dieter
Rebbereh Carsten
Day Ursula B.
Feiereisen Henry M.
Potter Roy K
Siemens Aktiengesellschaft
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