Power semiconductor component

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Patent

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Details

257777, 257728, 257724, 257712, 257713, H01L 2302, H01L 2348, H01L 2352, H01L 2334

Patent

active

060312793

ABSTRACT:
A power semiconductor component includes a first chip having a vertical first transistor. A second chip with a second vertical transistor is mounted on the first chip in such a way that load paths of the two transistors are connected in series. The configuration can easily be expanded into a full bridge.

REFERENCES:
patent: 4947234 (1990-08-01), Einzinger et al.
patent: 5502289 (1996-03-01), Takiar et al.
patent: 5532512 (1996-07-01), Fillion et al.
Japanese Patent Abstract No. 04075368 (Naritaka), dated Mar. 10, 1992.

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