Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2007-04-10
2007-04-10
Smith, Zandra V. (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S777000, C438S109000, C361S749000, C361S790000
Reexamination Certificate
active
11074026
ABSTRACT:
The present invention stacks integrated circuits into modules that conserve board surface area. In a two-high stack or module devised in accordance with a preferred embodiment of the present invention, a pair of integrated circuits is stacked, with one integrated circuit above the other. The two integrated circuits are connected with a pair of flexible circuit structures. Each of the pair of flexible circuit structures is partially wrapped about a respective opposite lateral edge of the lower integrated circuit of the module. The flex circuit pair connects the upper and lower integrated circuits and provides a thermal and electrical path connection path between the module and its application environment. The module has a bailout pattern with a different pitch and/or supplemental module contacts devised to allow combined signaling to the integrated circuits through contacts having a desired ballout footprint. The present invention may be employed to advantage in numerous configurations and combinations of integrated circuits in modules provided for high-density memories or high capacity computing.
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Buchle Jeff
Cady James W.
Dowden Julian
Roper David L.
Wehrly, Jr. James Douglas
Fish & Richardson P.C.
Smith Zandra V.
Staktek Group L.P.
Tran Thanh Y.
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