Power distribution within a folded flex package method and...

Details Power distribution within a folded flex package method and... Power distribution within a folded flex package method and...

2007-12-04

2007-12-04

Baumeister, B. William (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C174S254000, C257SE23177, C361S749000

Reexamination Certificate

active

10977908

ABSTRACT:
A device includes a folded flex substrate. A memory die is connected to a first side of the folded flex substrate. A logic die is connected to a second side of the folded flex substrate. A trace routing pattern of source voltage signals is identical to a trace routing pattern of collector voltage signals.

REFERENCES:
patent: 5316787 (1994-05-01), Frankeny et al.
patent: 6444921 (2002-09-01), Wang et al.
patent: 6594152 (2003-07-01), Dent

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