Microelectronic circuit package
Microelectronic device package having a heat sink structure for
Microelectronic devices with improved heat dissipation and...
Microelectronic package having chamber sealed by material...
Microelectronic package optionally having differing cover...
Microelectronic packages including nanocomposite dielectric...
Microwave/millimeter wave circuit structure with discrete flip-c
Miniature moldlocks for heatsink or flag for an overmolded...
Miniature silicon condenser microphone
Miniature silicon condenser microphone
Miniature silicon condenser microphone
Modular heat sink decoupling capacitor array forming heat...
Module with adhesively attached heat sink
Molded package for micromechanical devices and method of...
Molded semiconductor power device having heat sinks exposed...
Multi chip module
Multi-chip module
Multi-chip package having a contiguous heat spreader assembly
Multi-chip press-connected type semiconductor device
Multi-functional metal shield case and method for making the...