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Microelectronic circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Microelectronic device package having a heat sink structure for

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Microelectronic devices with improved heat dissipation and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Microelectronic package having chamber sealed by material...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Microelectronic package optionally having differing cover...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Microelectronic packages including nanocomposite dielectric...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Microwave/millimeter wave circuit structure with discrete flip-c

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Miniature moldlocks for heatsink or flag for an overmolded...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Miniature silicon condenser microphone

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Miniature silicon condenser microphone

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Miniature silicon condenser microphone

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Modular heat sink decoupling capacitor array forming heat...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Module with adhesively attached heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Molded package for micromechanical devices and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Molded semiconductor power device having heat sinks exposed...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Multi chip module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Multi-chip module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Multi-chip package having a contiguous heat spreader assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Multi-chip press-connected type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Multi-functional metal shield case and method for making the...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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