Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent
1997-10-14
2000-02-22
Williams, Alexander Oscar
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
257796, 257712, 257673, 257713, 361704, 361714, H01L 2312, H01L 2314, H01L 2348, H05K 116
Patent
active
060283548
ABSTRACT:
A thermally enhanced package for an integrated circuit, the integrated circuit having a surface with bond pads formed thereon, includes a heat sink structure attached to a central region of the integrated circuit surface inward of the bond pads. The package further includes a substrate attached to the heat sink structure. The heat sink structure includes a heat sink and first, second adhesive layers between the heat sink and the integrated circuit, substrate, respectively. The heat sink enhances heat transfer between the integrated circuit and the substrate. Further, the first, second adhesive layers decouple any difference in thermal expansion between the integrated circuit, the heat sink and the substrate.
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Amkor Technology Inc.
Williams Alexander Oscar
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