Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2006-02-10
2008-10-21
Chambliss, Alonzo (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S729000, C257S730000, C381S361000, C438S125000, C438S623000, C029S594000, C029S609100
Reexamination Certificate
active
07439616
ABSTRACT:
A silicon condenser microphone package includes a transducer unit, a substrate, and a cover. The substrate includes an upper surface transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and either the cover or the substrate includes an aperture.
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Chambliss Alonzo
Knowles Electronics LLC
Marshall & Gerstein & Borun LLP
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