Multi chip module

Details Multi chip module Multi chip module

2005-02-22

2005-02-22

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S707000, C257S712000, C257S713000, C257S762000

Reexamination Certificate

active

06858930

ABSTRACT:
A multi chip package, which includes a package substrate having a first side and an opposing second side. The first side is for receiving package electrical connections. Integrated circuits are electrically connected and structurally connected by their first sides to the second side of the package substrate. Heat spreaders are disposed adjacent the second side of the integrated circuits, where one each of the heat spreaders is associated with one each of the integrated circuits. A single stiffener having a first side and an opposing second side covers all of the integrated circuits and heat spreaders, where the first side of the stiffener is disposed adjacent the second side of the heat spreaders.

REFERENCES:
patent: 64-47058 (1989-02-01), None
patent: 1-199439 (1989-08-01), None

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