Miniature moldlocks for heatsink or flag for an overmolded...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

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Details

C257S625000

Reexamination Certificate

active

07091602

ABSTRACT:
A system of mold locks (28, 30) is formed on a heatsink (2) of a packaged semiconductor to prevent/mitigate delamination. The mold locks (4, 12) anchor a plastic mold compound (34) that forms the protective cover for the packaged semiconductor die. The mold locks (4, 12) are miniaturized to allow the positioning of them within the flag portion of the heatsink (2) and leadframe (24) such that a semiconductor die can be anchored above the mold locks (4, 12) formed within the flag portion of the heatsink/lead frame (2, 24). The miniaturized size of the said moldlocks (4, 12do not detract from the purpose of the die attach solder (36).

REFERENCES:
patent: 4107727 (1978-08-01), Ikezawa et al.
patent: 5278446 (1994-01-01), Nagaraj et al.
patent: 5535515 (1996-07-01), Jacoby
patent: 5701034 (1997-12-01), Marrs
patent: 5722161 (1998-03-01), Marrs
patent: 5990554 (1999-11-01), Golubic et al.
patent: 6294409 (2001-09-01), Hou
patent: 0577966 (1994-01-01), None
patent: 1202347 (2002-05-01), None
patent: 07161896 (1995-06-01), None
PCT/US03/30859 International Search Report.

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