Microelectronic package optionally having differing cover...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

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C257SE23193, C257SE23083, C438S106000

Reexamination Certificate

active

07485956

ABSTRACT:
A microelectronic package is provided that includes a microelectronic device and a cover. The device and the cover are typically substantially immobilized relative to each other. The cover typically has a higher coefficient of thermal expansion while the device has a higher effective stiffness. The package may be formed in wafer-level processes.

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patent: 2006/0216856 (2006-09-01), Zhao
U.S. Appl. No. 10/949,847, Office Action dated Jun. 30, 2006.
U.S. Appl. No. 10/949,847, Amendment dated Sep. 20, 2006.
U.S. Appl. No. 10/949,847, Notice of Allowance dated Mar. 8, 2007.

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