Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2005-08-16
2009-02-03
Ho, Tu-Tu V (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257SE23193, C257SE23083, C438S106000
Reexamination Certificate
active
07485956
ABSTRACT:
A microelectronic package is provided that includes a microelectronic device and a cover. The device and the cover are typically substantially immobilized relative to each other. The cover typically has a higher coefficient of thermal expansion while the device has a higher effective stiffness. The package may be formed in wafer-level processes.
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Humpston Giles
Tuckerman David B.
Ho Tu-Tu V
Lerner David Littenberg Krumholz & Mentlik LLP
Tessera Inc.
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