Modular heat sink decoupling capacitor array forming heat...

Details Modular heat sink decoupling capacitor array forming heat... Modular heat sink decoupling capacitor array forming heat...

2007-06-26

2007-06-26

Tran, Long K. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S625000, C257S707000, C257SE33075, C438S122000

Reexamination Certificate

active

11008798

ABSTRACT:
A modular heat sink decoupling capacitor array includes a plurality of modules, each defining parallel distributed decoupling plates, and each module forming a heat sink fi. Each module includes multiple spaced apart contacts for providing low inductance connections with an associated device. A power distribution interposer module is attached to a heat sink surface of the modular decoupling capacitor. The interposer module is used for implementing power delivery without using valuable ball grid array (BGA) connections and printed circuit board (PCB) layers.

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