LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package,Insulating material

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermal interface material with hotspot heat remover

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermal interface thickness control for a microprocessor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermal performance in flip chip/integral heat spreader...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermal spacer for stacked die package thermal management

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermal stress minimization in power semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermally and electrically enhanced ball grid array packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermally and electrically enhanced PBGA package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermally balanced power transistor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermally conductive adhesive tape for semiconductor devices...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermally conductive electrical assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermally conductive silk-screenable interface material

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermally enhanced cavity-down integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermally enhanced electronic flip-chip packaging with...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermally enhanced flip chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermally enhanced metal capped BGA package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermally enhanced micro-ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermally enhanced package for an integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermally enhanced semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermally enhanced semiconductor package and method of...