Thermally conductive electrical assembly

Details Thermally conductive electrical assembly Thermally conductive electrical assembly

1993-01-26

1994-03-29

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257712, 257713, H01L 2302

Patent

active

052987914

ABSTRACT:
A thermally conductive interface material formed of a polymeric binder and one or more thermally fillers is disclosed. One or both of the major surfaces of the interface material has a means for removing air from between that surface and the surface to which it is attached, such as a heat sinker an electronic component. Alternatively, the heat sink or component may have the air removal means instead of or in addition to the interface material. The air removal means may be a series of embossments, channels or grooves or throughholes. Preferably, the interface is a pressure sensitive acrylic adhesive material and more preferably, it is in the form of a tape.

REFERENCES:
patent: 4254431 (1981-03-01), Babuka et al.
patent: 4323914 (1982-04-01), Berndlmaier et al.
patent: 4396936 (1983-08-01), McIver et al.
patent: 4994903 (1991-02-01), Wroe et al.
patent: 5151777 (1992-09-01), Akin et al.
Patent Abstracts of Japan, vol. 13, No. 568, (E-861) Dec. 15, 1989, & JP-A-12 38 099 (Mitsubishi Electric Corp.) Sep. 22, 1989 *abstract*.
Patent Abstracts of Japan, vol. 15, No. 229 (E-1076) Jun. 11, 1991, & JP-A.varies.30 68 157 (Mitsubishi Electrical Corp.) Mar. 25, 1991 *abstract*.
IBM Technical Disclosure Bulletin, vol. 19, No. 9, Feb. 1977, New York US pp. 3321-3322 Arvanitakis "Modular Organic Carrier" *the whole document*.

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