Thermally and electrically enhanced PBGA package

Details Thermally and electrically enhanced PBGA package Thermally and electrically enhanced PBGA package

1998-08-12

1999-11-02

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257706, 257691, H01L 2310, H01L 2334

Patent

active

059776269

ABSTRACT:
The present invention includes a substrate having a die adhered thereon. The die and the substrate are interconnected by means of signal transferring means. Solder bumps are formed on the bottom side surface of the substrate. Molding compound is encapsulated among the substrate, the die and a heat spreader. A heat spreader is arranged over the top surface of the substrate. The heat spreader includes a plane having four supporting members that are set on the bottom side of the plane and at the corners of the plane. The supporting members are protruded from the plane to connect the heat spreaders and the substrate. The heat spreader further includes a protruded portion. A further supporting member is formed on the central portion of the protruded portion. The substrate has a die paddle formed thereon for receiving the die. A power ring is formed around the die paddle on the surface of the substrate for power input. A ground ring formed around the power ring on the substrate has ground pads. The supporting members of the heat spreader are connected on the ground pads by using the heat spreader attach material.

REFERENCES:
patent: 4692791 (1987-09-01), Bayraktaroglu
patent: 5311059 (1994-05-01), Banerji et al.
patent: 5371404 (1994-12-01), Juskey et al.

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