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Method of solder bonding and power semiconductor device manufact

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Methods for packing microfeature devices and microfeature...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Methods of fabrication of wafer-level vacuum packaged devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Methods of promoting adhesion between transfer molded IC...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Microcap wafer-level package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Microelectromechanical system package with environmental and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Microelectromechanical systems using thermocompression bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Microelectromechanical systems using thermocompression bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Microelectronic circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Microelectronic device package having a heat sink structure for

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Microelectronic devices with improved heat dissipation and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Microelectronic package having chamber sealed by material...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Microelectronic package optionally having differing cover...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Microelectronic packages including nanocomposite dielectric...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Microwave/millimeter wave circuit structure with discrete flip-c

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Miniature moldlocks for heatsink or flag for an overmolded...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Miniature silicon condenser microphone

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Miniature silicon condenser microphone

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Miniature silicon condenser microphone

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Modular heat sink decoupling capacitor array forming heat...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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