Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2005-02-08
2005-02-08
Coleman, William David (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
Reexamination Certificate
active
06853067
ABSTRACT:
Improved microelectromechanical systems (MEMS), processes and apparatus using thermocompression bonding are disclosed. For example, process embodiments are disclosed in which wafer-scale as well as die-scale thermocompression bonding is utilized to encapsulate MEMS and/or to provide electrical interconnections with MEMS. Apparatus embodiments include apparatus for performing thermocompression bonding and bonded hybrid structures manufactured in accordance with the process embodiments. Devices having various substrate bonding and/or sealing configurations variously offer the advantage of reduced size, higher manufacturing yields, reduced costs, improved reliability, improved compatibility with existing semiconductor manufacturing process and/or greater versatility of applications.
REFERENCES:
patent: 5600071 (1997-02-01), Sooriakumar et al.
patent: 5659195 (1997-08-01), Kaiser et al.
patent: 5995688 (1999-11-01), Aksyuk et al.
patent: 6000280 (1999-12-01), Miller et al.
patent: 6066515 (2000-05-01), Schoenfeld
patent: 6158283 (2000-12-01), Shinogi et al.
patent: 6287894 (2001-09-01), Sawin
patent: 6346742 (2002-02-01), Bryzek et al.
patent: 6426484 (2002-07-01), Hembree et al.
patent: 6614110 (2003-09-01), Pace
patent: 20020171144 (2002-11-01), Zhang et al.
Cohn Michael B.
Kung Joseph T.
Coleman William David
Fenwick & West LLP
MicroAssembly Technologies, Inc.
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