Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate
2011-07-26
2011-07-26
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
C257S774000, C257S780000, C257SE23038, C438S112000, C438S124000, C438S127000
Reexamination Certificate
active
07986048
ABSTRACT:
A method of manufacture of a package-on-package system includes: providing a package substrate; attaching a semiconductor die to the package substrate; forming an encapsulant around the semiconductor die to have a bottom exposed surface coplanar with a bottom surface of the package substrate and to have a top exposed surface with through openings extending therefrom through the bottom exposed surface; and creating through vias by applying solder into the through openings.
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Park DongSam
Yang JoungIn
Ishimaru Mikio
Parekh Nitin
Stats Chippac Ltd.
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