Package-on-package system with through vias and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Reexamination Certificate

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Details

C257S774000, C257S780000, C257SE23038, C438S112000, C438S124000, C438S127000

Reexamination Certificate

active

07986048

ABSTRACT:
A method of manufacture of a package-on-package system includes: providing a package substrate; attaching a semiconductor die to the package substrate; forming an encapsulant around the semiconductor die to have a bottom exposed surface coplanar with a bottom surface of the package substrate and to have a top exposed surface with through openings extending therefrom through the bottom exposed surface; and creating through vias by applying solder into the through openings.

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patent: 2009/0236726 (2009-09-01), Retuta et al.

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