Package for semiconductor device having frame-like molded portio

Details Package for semiconductor device having frame-like molded portio Package for semiconductor device having frame-like molded portio

1999-01-29

2000-08-01

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

257698, H04L 328

Patent

active

060971010

ABSTRACT:
The object of the present invention is to provide a premolded-type package for a semiconductor device which can be produced easily and exhibits a good airtightness, and to provide a method for effectively producing the same. A package for a semiconductor device has a wiring substrate 32 having a resin substrate 35 which is provided on its one surface with a wiring pattern 37, a chip-mounting portion 36 and a frame-like pattern 38 of a metal surrounding the wiring pattern 37 and the chip-mounting portion 36, and on the other surface with a plurality of terminals 41 electrically connected to the wiring pattern, and a frame-like molded portion 45 of thermosetting resin, molded on the frame-like pattern 38 on the wiring substrate 32.

REFERENCES:
patent: 5394011 (1995-02-01), Yamamoto et al.
patent: 5729437 (1998-03-01), Hashimoto et al.
patent: 5736789 (1998-04-01), Moscicki et al.
patent: 5737191 (1998-04-01), Horiuchi et al.
patent: 5940271 (1999-08-01), Mertol
patent: 6011304 (2000-01-01), Mertol

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