Packages for semiconductor die

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Reexamination Certificate

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C257S678000, C257S723000, C257S693000

Reexamination Certificate

active

10340331

ABSTRACT:
A ball grid array assembly includes a package cover that encapsulates a die and a portion of a substrate to which the die is attached, including an edge of the substrate. Encapsulation of the substrate edge by the cover reduces penetration of moisture or other contaminants into the substrate. The cover includes a rib that extends to contact a circuit board to which the ball grid array assembly is connected. With such a rib, planarity between the circuit board and the substrate is maintained during soldering.

REFERENCES:
patent: 4012768 (1977-03-01), Kirk et al.
patent: 4563725 (1986-01-01), Kirby
patent: 4641176 (1987-02-01), Keryhuel et al.
patent: 5139972 (1992-08-01), Neugebauer et al.
patent: 5163551 (1992-11-01), Bhatia
patent: 5216278 (1993-06-01), Lin et al.
patent: 5220486 (1993-06-01), Takubo et al.
patent: 5223739 (1993-06-01), Katsumata et al.
patent: 5246129 (1993-09-01), Small et al.
patent: 5293072 (1994-03-01), Tsuji et al.
patent: 5362679 (1994-11-01), Wakefield
patent: 5440169 (1995-08-01), Tomita et al.
patent: 5448114 (1995-09-01), Kondoh et al.
patent: 5557150 (1996-09-01), Variot et al.
patent: 5583377 (1996-12-01), Higgins, III
patent: 5583378 (1996-12-01), Marrs et al.
patent: 5604376 (1997-02-01), Hamburgen et al.
patent: 5625222 (1997-04-01), Yoneda et al.
patent: 5650593 (1997-07-01), McMillan et al.
patent: 5653020 (1997-08-01), Romano′ et al.
patent: 5677566 (1997-10-01), King et al.
patent: 5703398 (1997-12-01), Sono et al.
patent: 5708304 (1998-01-01), Tomita
patent: 5710459 (1998-01-01), Teng et al.
patent: 5766972 (1998-06-01), Takahashi et al.
patent: 5775510 (1998-07-01), Hodges
patent: 5796162 (1998-08-01), Huang
patent: 5819398 (1998-10-01), Wakefield
patent: 5869889 (1999-02-01), Chia et al.
patent: 5893724 (1999-04-01), Chakravorty et al.
patent: 5895967 (1999-04-01), Stearns et al.
patent: 5909056 (1999-06-01), Mertol
patent: 5914531 (1999-06-01), Tsunoda et al.
patent: 5930603 (1999-07-01), Tsuji et al.
patent: 5976912 (1999-11-01), Fukutomi et al.
patent: 5986340 (1999-11-01), Mostafazadeh et al.
patent: 5990544 (1999-11-01), Ohshima
patent: 5998241 (1999-12-01), Niwa
patent: 5998862 (1999-12-01), Yamanaka
patent: 6002178 (1999-12-01), Lin
patent: 6023098 (2000-02-01), Higashiguchi et al.
patent: 6032098 (2000-02-01), Takahashi et al.
patent: 6032355 (2000-03-01), Tseng et al.
patent: 6032362 (2000-03-01), Okikawa et al.
patent: 6038136 (2000-03-01), Weber
patent: 6048754 (2000-04-01), Katayama et al.
patent: 6049038 (2000-04-01), Suzuki
patent: 6075289 (2000-06-01), Distefano
patent: 6080932 (2000-06-01), Smith et al.
patent: 6114189 (2000-09-01), Chia et al.
patent: 6114192 (2000-09-01), Tsunoda et al.
patent: 6149010 (2000-11-01), Tanaka et al.
patent: 6166434 (2000-12-01), Desai et al.
patent: 6166435 (2000-12-01), Leu et al.
patent: 6175497 (2001-01-01), Tseng et al.
patent: 6179127 (2001-01-01), Kato et al.
patent: 6187612 (2001-02-01), Orcutt
patent: 6225144 (2001-05-01), How et al.
patent: 6249403 (2001-06-01), Tokisue et al.
patent: 6258630 (2001-07-01), Kawahara
patent: 6261870 (2001-07-01), Haehn et al.
patent: 6271058 (2001-08-01), Yoshida
patent: 6329220 (2001-12-01), Bolken et al.
patent: 6331453 (2001-12-01), Bolken et al.
patent: 6333564 (2001-12-01), Katoh et al.
patent: 6351030 (2002-02-01), Havens et al.
patent: 6362530 (2002-03-01), Lee et al.
patent: 6395124 (2002-05-01), Oxman et al.
patent: 6404070 (2002-06-01), Higashi et al.
patent: 6425484 (2002-07-01), Sakurai
patent: 6429530 (2002-08-01), Chen
patent: 6432742 (2002-08-01), Guan et al.
patent: 6432749 (2002-08-01), Libres
patent: 6486554 (2002-11-01), Johnson
patent: 6541310 (2003-04-01), Lo et al.
patent: 6568535 (2003-05-01), Pylant
patent: 6576988 (2003-06-01), Corisis
patent: 6626656 (2003-09-01), Thummel
patent: 6644982 (2003-11-01), Ondricek et al.
patent: 6650005 (2003-11-01), Hung et al.
patent: 6660558 (2003-12-01), Bolken et al.
patent: 6825550 (2004-11-01), Akram
patent: 2001/0040288 (2001-11-01), Matsushima et al.
patent: 2002/0060369 (2002-05-01), Akram
patent: 2570221 (1984-04-01), None
patent: 358122753 (1983-07-01), None
patent: 359188948 (1984-10-01), None
patent: 01298753 (1989-12-01), None
patent: 403116949 (1991-05-01), None
patent: 403147355 (1991-06-01), None

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