Packages for semiconductor die

Details Packages for semiconductor die Packages for semiconductor die

2007-07-03

2007-07-03

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S678000, C257S723000, C257S693000

Reexamination Certificate

active

10340331

ABSTRACT:
A ball grid array assembly includes a package cover that encapsulates a die and a portion of a substrate to which the die is attached, including an edge of the substrate. Encapsulation of the substrate edge by the cover reduces penetration of moisture or other contaminants into the substrate. The cover includes a rib that extends to contact a circuit board to which the ball grid array assembly is connected. With such a rib, planarity between the circuit board and the substrate is maintained during soldering.

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