Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Patent
1996-05-24
1999-02-02
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With specified encapsulant
257778, 257690, 257787, 257789, 257734, 257687, 257712, H05K 720, H01L 2328, H01L 2348
Patent
active
058669531
ABSTRACT:
An apparatus and a method for providing a heat sink on an upper surface of a semiconductor chip by placing a heat-dissipating material thereon which forms a portion of a glob top. The apparatus comprises a semiconductor chip attached to and in electrical communication with a substrate. A barrier glob top material is applied to the edges of the semiconductor chip on the surface ("opposing surface") opposite the surface attached to the substrate to form a wall around a periphery of an opposing surface of the semiconductor chip wherein the barrier glob top material also extends to contact and adhere to the substrate. The wall around the periphery of the opposing surface of the semiconductor chip forms a recess. A heat-dissipating glob top material is disposed within the recess to contact the opposing surface for the semiconductor chip.
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Akram Salman
Wark James M.
Micro)n Technology, Inc.
Thomas Tom
Williams Alexander Oscar
LandOfFree
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