Packaging material for electronic components

Details Packaging material for electronic components Packaging material for electronic components

1997-01-13

1997-12-16

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified filler material

257789, 257792, 257793, 257794, H01L 2329

Patent

active

056989040

ABSTRACT:
A packaging material for electronic components is provided which inhibits the cracking of a passivation film on an encapsulated chip and inhibits the breaking of an interconnecting metallization pattern in a chip of an electronic component and meets the miniaturization trend for electronic components. The packaging material includes: a resin, and 80% to 93% by weight, relative to the total amount of the packaging material, of a filler made up of particles having an average particle size of 30 .mu.m or less, at least 90% by weight of which are spherically shaped or have rounded ends and/or edges.

REFERENCES:
patent: 4931852 (1990-06-01), Brown et al.
patent: 5113241 (1992-05-01), Yanagida et al.
patent: 5202753 (1993-04-01), Shintai
patent: 5334674 (1994-08-01), Naka et al.

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