Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate
2005-04-12
2005-04-12
Clark, S. V. (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
C257S739000
Reexamination Certificate
active
06879050
ABSTRACT:
Methods and apparatuses for packaging a microelectronic device. One embodiment can include a packaged microelectronic device comprising a microelectronic die, an interposer substrate, and a casing encapsulating at least a portion of the die. The microelectronic die can have a first side attached to the substrate, a plurality of contacts on the first side, and an integrated circuit coupled to the contacts. The die can also include a second side with a plurality of first interconnecting elements on the second side of the die, such as first non-planar features. The casing can include an interior surface and a plurality of second interconnecting elements on the interior surface, such as second non-planar features. The first non-planar features on the second side of the die mate with second non-planar features on the interior surface of the casing. Accordingly, delamination along the interface between the microelectronic die and the casing is inhibited.
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Corisis David
Thurgood Blaine
Clark S. V.
Perkins Coie LLP
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